【電磁技術(shù)在線】【元件篇】- 4. 高功擊穿
講師：Carlos Vicente
00：20 射頻系統(tǒng)擊穿后果
02：00 倍增擊穿（真空）vs 電暈（非真空）
04：15 仿真流程
07：45 濾波器 CST-SPARK3D demo
16：20 倍增擊穿結(jié)果
22：00 電子移動(dòng)結(jié)果
22：45 電暈結(jié)果
Some RF systems operate at higher andhigher power levels，e.g. in satellites to increase the overall throughput， or in particle accelerators toreach greater particle energies， or in high power microwave sources etc.
In the conceptual design we pay attention to the performance of the device. Then,the device has to be studied in the context of its applications. Therefore, the detailed and the final design might be more complex and might also take into account some physical parameters which were not necessary during the concept phase to get optimal performances. Of course, the device might not work in the context of its use. Therefore, It appears necessary to perform any thermal,mechanical and power handling analysis such as the prediction of the Multipactor and the Corona effect.
For certain high power applications,the determination of the breakdown power level is key. For instance, in satellite applications, breakdown under vacuum conditions (the so-called multipactor effect) is of paramount importance, since it can destroy the component. Also, in ground applications, gas breakdown can occur, also rendering useless the hardware.
With CST MWS combined with SPARK3D or CST PS, one can perform such calculations by importing the EM fields from the CST MWS and you will get the máximum power that your device can handle.
In this video, you will learn how to link the CST particle studio and SPARK3D, and do the high power breakdown analysis in SPARK3D. The meaning of most commonly used settings are explained.
